ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,756, issued on April 14. "Method for manufacturing semiconductor device" was invented by Hiroaki Matsubara (Tokyo), Daisuke Ikeda (Tokyo),... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor package" was invented by Bo ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stiffeners around indivi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stiffeners around indivi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... Read More